1 3 2 2.870.25 1.59 0.51 14.00 18.00 16.00 1.00 proprietary and confidential - the information contained in this drawing is the sole property of ironwood electronics, inc. any reproduction in part or as a whole without the written permission of ironwood electronics, inc. is prohibited. u.s. patent no. 8,091,222 b2 item no. description material 1 p-s519a, socket pin, 1.0mm centers minimum, #4 clip body - gold plated brass 360, clip - gold plated beryllium copper 172 2 solder ball, 0.024" dia see table 3 non-clad substrate fr4 standard part no. suffix solder ball alloy -42 sn63pb37 -42f* sn96.5ag3.0cu0.5 *rohs compliant ironwood electronics, inc. tele: (800) 404-0204 www.ironwoodelectronics.com tolerances: hole diameters 0.03mm [0.001"], pitches (from true position) 0.025mm [0.001"], substrate thickness tolerance 10%, all other tolerances 0.13mm [0.005"] unless stated otherwise. materials and specifications are subject to change without notice. description: sf-bga152 14mm x 18mm, 13x17 array, 1mm pitch primary dimension units are millimeters, secondary dimension units are [inches], weight is in grams. status: eco rev. a date: 11/20/2014 material: n/a finish: n/a weight: 1.03 sf-bga152c-b-42 drawing scale: 5:1 sheet: 1 of 1 eng: s. faiz file: sf-bga152c-b-42 dwg drawn by: m. raske SF-BGA152C-B-42F drawing
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